SE 2011 POTTING COMPOUND

PRIMERLESS SELF BONDING SILICONE ENCAPSULANT FOR ELECTRONICS

KEY PROPERTIES:


  • Self bonding with adhesion to most materials
  • Low viscosity, very flowable
  • Cures without heating at room temperature
  • UL approved / UL94 HB certified
  • Good adhesion ensures water tight seals for wire terminations

UNCURED PROPERTIES

Colour:


Consistency:



Cure Time:



Tack Free:


Shelf Life:

Black


Low Viscosity Liquid (4000 mpas)


Approx 24 hours (Room Temperature)


45-60 minutes


6 months in dry conditions @ 20℃

Colour:


Consistency:


Cure Time:


Tack Free:


Shelf Life:

Black


Low Viscosity Liquid (4000 mpas)


Approx 24 hours (Room Temperature)


45-60 minutes


6 months in dry conditions @ 20℃

CURED PROPERTIES

Specific Gravity:


Hardness Shore A:


Dielectric Strength:


Temperature Range:

1.05


23 Shore 'A'


20 kV/mm


-55℃ to +200℃