ACC SE 2011 POTTING COMPOUND
SE 2011 POTTING COMPOUND
PRIMERLESS SELF BONDING SILICONE ENCAPSULANT FOR ELECTRONICS
KEY PROPERTIES:
- Self bonding with adhesion to most materials
- Low viscosity, very flowable
- Cures without heating at room temperature
- UL approved / UL94 HB certified
- Good adhesion ensures water tight seals for wire terminations
UNCURED PROPERTIES
CURED PROPERTIES
Specific Gravity:
Hardness Shore A:
Dielectric Strength:
Temperature Range:
1.05
23 Shore 'A'
20 kV/mm
-55℃ to +200℃