sales@intek-uk.com
+44 1670 734400

POTTING COMPOUND – PRIMERLESS SELF BONDING SILICONE ENCAPSULANT FOR ELECTRONICS

SE 2011 Self bonding potting compound

Key Properties:

  • Self bonding with adhesion to most materials
  • Low viscosity, very flowable
  • Cures without heating at room temperature
  • UL approved / UL94 HB certified
  • Good adhesion ensures water tight seals for wire terminations

Uncured Properties

Colour: Black
Viscocity Low viscosity liquid (4000 mpas)
Cure Time: Approx 24 hours (Room Temperature) or heat cure
Tack Free: 45-60 minutes
Shelf Life: 6 months in dry conditions @ 20C

Cured Properties

Specific Gravity: 1.05
Hardness: 23 Shore 'A'
Dielectric Strength: 20 kV/mm
Temperature Range: – 55 to + 200 C

CONTACT

01670 734400
+44 1670 734400
sales@intek-uk.com
www.intek-uk.com

Intek Adhesives
Unit 20
Atley Business Park,
Cramlington,
Northumberland,
NE23 1WP

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