SE 2011

ACC SE 2011 Potting Compound

PRIMERLESS SELF BONDING SILICONE ENCAPSULANT FOR ELECTRONICS

SE 2011 Self bonding potting compound

Key Properties:

  • Self bonding with adhesion to most materials
  • Low viscosity, very flowable
  • Cures without heating at room temperature
  • UL approved / UL94 HB certified
  • Good adhesion ensures water tight seals for wire terminations

Uncured Properties

Cured Properties

Colour:

Black

Specific Gravity:

1.05

Consistency:

Low viscosity liquid (4000 mpas)

Hardness

23 Shore ‘A’

Cure Time:

Approx 24 hours (Room Temperature)

Dielectric Strength:

20 Kv/mm

Tack Free:

45-60 minutes

Temperature Range:

55 to + 200 C

Shelf Life:

6 months in dry conditions @ 20 C

   

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